Mobile chips promise to turn smartphones into ‘monsters’

Processors from Qualcomm, Samsung, and Apple will make smartphones in the second half of this year and next year even stronger.
SoC (System on a Chip) is an integrated circuit in which important components (microcontrollers, microprocessors, or signal processing cores, memory blocks) are in only one chip. SoC plays an important role, as the centerpiece, responsible for controlling the whole system. Due to its all in one and small size, the SoC aims to highly mobiles and computers.
There are so many manufacturers who produce SoC in the world. Below is a series of high-end chips that will probably be available in the second half of 2017 and in 2018:
Qualcomm Snapdragon 845
Qualcomm’s chips make up the bulk of high-end mobile devices. According to the some rumor, the next generation, called Snapdragon 845 is based on 7 nm production process with a smaller size, less power consumption but higher performance.
Specifically, the Snapdragon 845 delivers 20-30% faster processing compared to the current Snapdragon 835, as well as 30% more power than the Snapdragon 821 while consuming 40% less power. The chip will come with the Adreno 630 graphics processor (GPU), 30% more efficient than the Adreno 530 on the Snapdragon 835.
Samsung Exynos 9 (2018)

Until now, Samsung’s SoC has not disclosed many parameters, even the name has not been revealed. Phonearena predicted it could be called Exynos 8900, Exynos 9 Super-duper 2018 Editon. However, two things will happen on this chipset: appear on the Galaxy S9 next year for some Asian markets and incorporate the latest ARM Cortex-A75 and ARM A55 microarchitecture.
According to recent leaks, the A75 alone can boost performance up to 50% in multi-threaded processing, improve memory capacity by 16%, and increase performance by 30% for large screen devices. Meanwhile, the A55 core also reduced power consumption by 15%, doubling its memory capacity compared to previous generations.
The new Exynos chip will outperform the Mali-G72 GPU by up to 20% efficiency and 25% more energy efficient than the Mali-G71. According to the assessment, Samsung’s chips will give inferior strength to Snapdragon 845 Qualcomm.
Apple A11

Apple’s new chip will be produced by TSMC partners based on 10nm process instead of 16nm as on A10. This means that the chip will be smaller in size, more power efficient and stronger. As predicted, the A11 will accelerate 20% and save power 40% less than the predecessor chip.

Currently, not much information on the A11, except that Apple will continue to put into Fusion design, combined PowerVR GPU. The product will appear on the set of 3 new iPhone (iPhone 7s, 7s Plus and iPhone 8) scheduled to launch in September 2017.

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